Siemon 4x10Gb/s DAC, QSFP+ High Speed Interconnect, Breakout Passive Direct Attach Copper Cable

Siemon active and passive copper cable assemblies were created as a cost-effective alternative to optical modules for short-range links in high-speed interconnect applications like high-performance computing (HPC), enterprise networking, and network storage.

These assemblies can support data transfer speeds of up to 10 Gb/s per lane, which meets or exceeds current industry standards. For better support of high frequency data rates, these completely shielded assemblies combine twin-axial shielded cable design with strong die cast housings. Because of their fully shielded construction, the assemblies are impedance matched to assure interoperability and minimise EMI leakage. The active cables use signal processing within the connection back shells to increase the length of copper cables beyond what passive copper solutions can provide.

SFP+, QSFP+, SFP28, QSFP28, and QSFP+ 56G direct attach assembly versions are available, as well as a number of hybrid solutions. MSA (Multi-Source Agreement) compatible Siemon High Speed Interconnects provide compatibility with equipment from a variety of suppliers.